Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis

por Amli, Siti Farahnabilah Muhd, Salleh, Mohd Arif Anuar Mohd, Aziz, Mohd Sharizal Abdul, Yasuda, Hideyuki, Nogita, Kazuhiro, Abdullah, Mohd Mustafa Al Bakri, Nemes, Ovidiu, Sandu, Andrei Victor, Vizureanu, Petrica
Publicado 2023

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

por Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al Bakri, Zaimi, Nur Syahirah Mohamad, Sandu, Andrei Victor, Vizureanu, Petrica, Rylski, Adam, Amli, Siti Farahnabilah Muhd
Publicado 2022

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

por Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Amli, Siti Farahnabilah Muhd, Said, Rita Mohd, Saud, Norainiza, Abdullah, Mohd Mustafa Al Bakri, Vizureanu, Petrica, Rylski, Adam, Chaiprapa, Jitrin, Nabialek, Marcin
Publicado 2021