Carbon nanotube bumps for the flip chip packaging system

por Yap, Chin Chong, Brun, Christophe, Tan, Dunlin, Li, Hong, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang
Publicado 2012

CNT-Based Inkjet-Printed RF Gas Sensor: Modification of Substrate Properties during the Fabrication Process

por George, Julien, Abdelghani, Aymen, Bahoumina, Prince, Tantot, Olivier, Baillargeat, Dominique, Frigui, Kamel, Bila, Stéphane, Hallil, Hamida, Dejous, Corinne
Publicado 2019