Integrated interconnect technologies for 3D nanoelectronic systems

por Bakir, Muhannad S, Meindl, James D
Publicado 2008

Handbook of 3D integration: design, test, and thermal management

por Franzon, Paul D, Marinissen, Eric Jan, Bakir, Muhannad S, Garrou, Philip, Koyanagi, Mitsumasa, Ramm, Peter
Publicado 2019

Myomatrix arrays for high-definition muscle recording

por Chung, Bryce, Zia, Muneeb, Thomas, Kyle A., Michaels, Jonathan A., Jacob, Amanda, Pack, Andrea, Williams, Matthew J., Nagapudi, Kailash, Teng, Lay Heng, Arrambide, Eduardo, Ouellette, Logan, Oey, Nicole, Gibbs, Rhuna, Anschutz, Philip, Lu, Jiaao, Wu, Yu, Kashefi, Mehrdad, Oya, Tomomichi, Kersten, Rhonda, Mosberger, Alice C., O’Connell, Sean, Wang, Runming, Marques, Hugo, Mendes, Ana Rita, Lenschow, Constanze, Kondakath, Gayathri, Kim, Jeong Jun, Olson, William, Quinn, Kiara N., Perkins, Pierce, Gatto, Graziana, Thanawalla, Ayesha, Coltman, Susan, Kim, Taegyo, Smith, Trevor, Binder-Markey, Ben, Zaback, Martin, Thompson, Christopher K., Giszter, Simon, Person, Abigail, Goulding, Martyn, Azim, Eiman, Thakor, Nitish, O’Connor, Daniel, Trimmer, Barry, Lima, Susana Q., Carey, Megan R., Pandarinath, Chethan, Costa, Rui M., Pruszynski, J. Andrew, Bakir, Muhannad, Sober, Samuel J.
Publicado 2023