Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

por Jun, So-Yeon, Bang, Jung-Hwan, Kim, Min-Su, Han, Deok-Gon, Lee, Tae-Young, Yoo, Sehoon
Publicado 2023

The Usefulness of Rectified VEMP

por Lee, Kang Jin, Kim, Min Soo, Son, Eun Jin, Lim, Hye Jin, Bang, Jung Hwan, Kang, Jae Goo
Publicado 2008