On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

por Roshanghias, Ali, Dreissigacker, Marc, Scherf, Christina, Bretthauer, Christian, Rauter, Lukas, Zikulnig, Johanna, Braun, Tanja, Becker, Karl-F., Rzepka, Sven, Schneider-Ramelow, Martin
Publicado 2020