Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb

por Skwarek, Agata, Illés, Balázs, Hurtony, Tamás, Bušek, David, Dušek, Karel
Publicado 2020

Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing Process

por Tichý, Tomáš, Šefl, Ondřej, Veselý, Petr, Dušek, Karel, Bušek, David
Publicado 2021

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

por Illés, Balázs, Hurtony, Tamás, Krammer, Olivér, Medgyes, Bálint, Dušek, Karel, Bušek, David
Publicado 2019

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

por Hurtony, Tamás, Krammer, Oliver, Illés, Balázs, Harsányi, Gábor, Bušek, David, Dušek, Karel
Publicado 2020

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

por Dušek, Karel, Veselý, Petr, Bušek, David, Petráč, Adam, Géczy, Attila, Illés, Balázs, Krammer, Oliver
Publicado 2021

Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic

por Géczy, Attila, Havellant, Gergő, Bátorfi, Réka, Skwarek, Agata, Dušek, Karel, Bušek, David, Illés, Balázs
Publicado 2023