Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

por Zhang, Yuemin, Guo, Haiyun, Cao, Jun, Wu, Xuefeng, Jia, Hewei, Chang, Andong
Publicado 2023

Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire

por Zhou, Hongliang, Chang, Andong, Fan, Junling, Cao, Jun, Zhang, Yingchong, An, Bin, Xia, Jie
Publicado 2023

A Review of Silver Wire Bonding Techniques

por An, Bin, Zhou, Hongliang, Cao, Jun, Ming, Pingmei, Persic, John, Yao, Jingguang, Chang, Andong
Publicado 2023

Research Progress on Bonding Wire for Microelectronic Packaging

por Zhou, Hongliang, Zhang, Yingchong, Cao, Jun, Su, Chenghao, Li, Chong, Chang, Andong, An, Bin
Publicado 2023

Copper Wire Bonding: A Review

por Zhou, Hongliang, Chang, Andong, Fan, Junling, Cao, Jun, An, Bin, Xia, Jie, Yao, Jingguang, Cui, Xiaobin, Zhang, Yingchong
Publicado 2023