A high thermal stability ohmic contact for GaN-based devices

por Wu, Chia-Yi, Chao, Tien-Sheng, Chou, Yi-Chia
Publicado 2023

Low-temperature poly-Si nanowire junctionless devices with gate-all-around TiN/Al(2)O(3) stack structure using an implant-free technique

por Su, Chun-Jung, Tsai, Tzu-I, Lin, Horng-Chih, Huang, Tiao-Yuan, Chao, Tien-Sheng
Publicado 2012

Improvement in pH Sensitivity of Low-Temperature Polycrystalline-Silicon Thin-Film Transistor Sensors Using H(2) Sintering

por Yen, Li-Chen, Tang, Ming-Tsyr, Chang, Fang-Yu, Pan, Tung-Ming, Chao, Tien-Sheng, Lee, Chiang-Hsuan
Publicado 2014

Advanced Cu chemical displacement technique for SiO(2)-based electrochemical metallization ReRAM application

por Chin, Fun-Tat, Lin, Yu-Hsien, You, Hsin-Chiang, Yang, Wen-Luh, Lin, Li-Min, Hsiao, Yu-Ping, Ko, Chum-Min, Chao, Tien-Sheng
Publicado 2014