Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release

por Chen, Chuantong, Suganuma, Katsuaki
Publicado 2020

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

por Choe, Chanyang, Chen, Chuantong, Noh, Seungjun, Suganuma, Katsuaki
Publicado 2018

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

por Kim, Dongjin, Yamamoto, Yasuyuki, Nagao, Shijo, Wakasugi, Naoki, Chen, Chuantong, Suganuma, Katsuaki
Publicado 2019