Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

por Lee Sanchez, William Anderson, Li, Jia-Wun, Chiu, Hsien-Tang, Cheng, Chih-Chia, Chiou, Kuo-Chan, Lee, Tzong-Ming, Chiu, Chih-Wei
Publicado 2022