Bottom-up plasma-enhanced atomic layer deposition of SiO(2) by utilizing growth inhibition using NH(3) plasma pre-treatment for seamless gap-fill process

por Choi, Yoenju, Kim, Taehoon, Lee, Hangyul, Park, Jusung, Park, Juhwan, Ryu, Dongho, Jeon, Woojin
Publicado 2022