Process Optimization of Via Plug Multilevel Interconnections in CMOS Logic Devices

por Cui, Yinhua, Jeong, Jeong Yeul, Gao, Yuan, Pyo, Sung Gyu
Publicado 2019

Effect of Contact Plug Deposition Conditions on Junction Leakage and Contact Resistance in Multilevel CMOS Logic Interconnection Device

por Cui, Yinhua, Jeong, Jeong Yeul, Gao, Yuan, Pyo, Sung Gyu
Publicado 2020

Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects

por Wang, Yao, Hu, Chuan, Xiang, Xun, Zheng, Wei, Yin, Zhendong, Cui, Yinhua
Publicado 2022

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

por He, Siliang, Xiong, Bifu, Xu, Fangyi, Chen, Biyang, Cui, Yinhua, Hu, Chuan, Yue, Gao, Shen, Yu-An
Publicado 2023