Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO(2)/Si Interfaces after Different Thermal Loading

por Zhang, Min, Chen, Fangzhou, Qin, Fei, Chen, Si, Dai, Yanwei
Publicado 2023

Macro–Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling

por An, Tong, Zheng, Xueheng, Qin, Fei, Dai, Yanwei, Gong, Yanpeng, Chen, Pei
Publicado 2023