Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

por Kolenak, Roman, Melus, Tomas, Drapala, Jaromir, Gogola, Peter, Pasak, Matej
Publicado 2023

Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite

por Kolenak, Roman, Pluhar, Alexej, Drapala, Jaromir, Babincova, Paulina, Pasak, Matej
Publicado 2023

Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

por Kolenak, Roman, Kostolny, Igor, Drapala, Jaromir, Babincova, Paulina, Pasak, Matej
Publicado 2021

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

por Kolenak, Roman, Kostolny, Igor, Drapala, Jaromir, Urminsky, Jan, Pluhar, Alexej, Babincova, Paulina, Drimal, Daniel
Publicado 2022