Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

por Braun, Tanja, Becker, Karl-Friedrich, Hoelck, Ole, Voges, Steve, Kahle, Ruben, Dreissigacker, Marc, Schneider-Ramelow, Martin
Publicado 2019

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

por Roshanghias, Ali, Dreissigacker, Marc, Scherf, Christina, Bretthauer, Christian, Rauter, Lukas, Zikulnig, Johanna, Braun, Tanja, Becker, Karl-F., Rzepka, Sven, Schneider-Ramelow, Martin
Publicado 2020