Cu(3)Sn joint based on transient liquid phase bonding of Cu@Cu(6)Sn(5) core–shell particles

por Wang, Jintao, Wang, Jianqiang, Duan, Fangcheng, Chen, Hongtao
Publicado 2023

CoSn(3) Intermetallic Nanoparticles for Electronic Packaging

por Wang, Jintao, Lv, Ziwen, Zhang, Luobin, Duan, Fangcheng, Zhang, Weiwei, Chen, Hongtao
Publicado 2022

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

por Wang, Jintao, Wang, Xinjie, Zhang, Lin, Zhang, Luobin, Duan, Fangcheng, Wang, Fengyi, Zhang, Weiwei, Wang, Jianqiang, Zhang, Zheng, Hang, Chunjin, Chen, Hongtao
Publicado 2022