Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

por Choi, Gwang-Mun, Jang, Ki-Seok, Choi, Kwang-Seong, Joo, Jiho, Yun, Ho-Gyeong, Lee, Chanmi, Eom, Yong-Sung
Publicado 2021

Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding

por Le, Xuan-Luc, Le, Xuan-Bach, Hwangbo, Yuhwan, Joo, Jiho, Choi, Gwang-Mun, Eom, Yong-Sung, Choi, Kwang-Seong, Choa, Sung-Hoon
Publicado 2023