MEMS development focusing on collaboration using common facilities: a retrospective view and future directions

por Esashi, Masayoshi
Publicado 2021

Stacked Integration of MEMS on LSI

por Esashi, Masayoshi, Tanaka, Shuji
Publicado 2016

Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions

por Satoh, Shiro, Fukushi, Hideyuki, Esashi, Masayoshi, Tanaka, Shuji
Publicado 2018

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

por Makihata, Mitsutoshi, Muroyama, Masanori, Tanaka, Shuji, Nakayama, Takahiro, Nonomura, Yutaka, Esashi, Masayoshi
Publicado 2018

On‐Chip Micro‐Pseudocapacitors for Ultrahigh Energy and Power Delivery

por Han, Jiuhui, Lin, Yu‐Ching, Chen, Luyang, Tsai, Yao‐Chuan, Ito, Yoshikazu, Guo, Xianwei, Hirata, Akihiko, Fujita, Takeshi, Esashi, Masayoshi, Gessner, Thomas, Chen, Mingwei
Publicado 2015