Simple Device to Measure Pressure Using the Stress Impedance Effect of Amorphous Soft Magnetic Thin Film

por Froemel, Joerg, Akita, Satoru, Tanaka, Shuji
Publicado 2020

Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

por Froemel, Joerg, Diguet, Gildas, Muroyama, Masanori
Publicado 2021

Tactile Sensing Using Magnetic Foam

por Diguet, Gildas, Froemel, Joerg, Muroyama, Masanori, Ohtaka, Koichi
Publicado 2022

Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames

por Tanaka, Koki, Hirano, Hideki, Kumano, Masafumi, Froemel, Joerg, Tanaka, Shuji
Publicado 2018

Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

por Tanaka, Koki, Wang, Wei-Shan, Baum, Mario, Froemel, Joerg, Hirano, Hideki, Tanaka, Shuji, Wiemer, Maik, Otto, Thomas
Publicado 2016