Study on Delamination Between Polymer Materials and Metals in IC Packaging Process

por Pan, Cheng-Tang, Wang, Shao-Yu, Yen, Chung-Kun, Ho, Chien-Kai, Yen, Jhan-Foug, Chen, Shi-Wei, Fu, Fan-Rui, Lin, Yi-Tzu, Lin, Cing-Hao, Kumar, Ajay, Shiue, Yow-Ling
Publicado 2019