Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

por Li, Ming-Ding, Shen, Xiao-Quan, Chen, Xin, Gan, Jia-Ming, Wang, Fang, Li, Jian, Wang, Xiao-Liang, Shen, Qun-Dong
Publicado 2022