Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

por Liu, Chien-Min, Lin, Han-Wen, Huang, Yi-Sa, Chu, Yi-Cheng, Chen, Chih, Lyu, Dian-Rong, Chen, Kuan-Neng, Tu, King-Ning
Publicado 2015