Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb

por Skwarek, Agata, Illés, Balázs, Hurtony, Tamás, Bušek, David, Dušek, Karel
Publicado 2020

Microstructure Influence of SACX0307-TiO(2) Composite Solder Joints on Thermal Properties of Power LED Assemblies

por Skwarek, Agata, Ptak, Przemysław, Górecki, Krzysztof, Hurtony, Tamás, Illés, Balázs
Publicado 2020

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

por Illés, Balázs, Hurtony, Tamás, Krammer, Olivér, Medgyes, Bálint, Dušek, Karel, Bušek, David
Publicado 2019

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

por Hurtony, Tamás, Krammer, Oliver, Illés, Balázs, Harsányi, Gábor, Bušek, David, Dušek, Karel
Publicado 2020

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys

por Skwarek, Agata, Krammer, Olivér, Hurtony, Tamás, Ptak, Przemysław, Górecki, Krzysztof, Wroński, Sebastian, Straubinger, Dániel, Witek, Krzysztof, Illés, Balázs
Publicado 2021