Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu

por Juang, Jing-Ye, Lu, Chia-Ling, Li, Yu-Jin, Tu, K. N., Chen, Chih
Publicado 2018

Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

por Juang, Jing-Ye, Lu, Chia-Ling, Chen, Kuan-Ju, Chen, Chao-Chang A., Hsu, Po-Ning, Chen, Chih, Tu, K. N.
Publicado 2018

A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps

por Chang, Yuan-Wei, Hu, Chia-chia, Peng, Hsin-Ying, Liang, Yu-Chun, Chen, Chih, Chang, Tao-chih, Zhan, Chau-Jie, Juang, Jing-Ye
Publicado 2018