Evaluation of Adhesion Properties of Thin Film Structure through Surface Acoustic Wave Dispersion Simulation

por Choi, Yu Min, Kang, Dongchan, Kim, Jeong Nyeon, Park, Ik Keun
Publicado 2022

Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System

por Kim, Tae Hyeong, Kang, Dongchan, Kim, Jeong Nyeon, Park, Ik Keun
Publicado 2023

Reliability Analysis of PAUT Based on the Round-Robin Test for Pipe Welds with Thermal Fatigue Cracks

por Kang, Dongchan, Choi, Yu Min, Lee, Dong Min, Kim, Jung Bin, Kim, Yong Kwon, Park, Tae Sung, Park, Ik Keun
Publicado 2023