Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers

por Schäfer, D., Eisenmenger-Sittner, C., Chirtoc, Mihai, Kijamnajsuk, P., Kornfeind, N., Hutter, H., Neubauer, E., Kitzmantel, M.
Publicado 2011

Characterisation of sputter deposited niobium and boron interlayer in the copper–diamond system

por Hell, J., Chirtoc, M., Eisenmenger-Sittner, C., Hutter, H., Kornfeind, N., Kijamnajsuk, P., Kitzmantel, M., Neubauer, E., Zellhofer, K.
Publicado 2012