Advanced Cu chemical displacement technique for SiO(2)-based electrochemical metallization ReRAM application

por Chin, Fun-Tat, Lin, Yu-Hsien, You, Hsin-Chiang, Yang, Wen-Luh, Lin, Li-Min, Hsiao, Yu-Ping, Ko, Chum-Min, Chao, Tien-Sheng
Publicado 2014