Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

por Kolenak, Roman, Kostolny, Igor, Drapala, Jaromir, Babincova, Paulina, Pasak, Matej
Publicado 2021

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

por Kolenak, Roman, Kostolny, Igor, Drapala, Jaromir, Urminsky, Jan, Pluhar, Alexej, Babincova, Paulina, Drimal, Daniel
Publicado 2022