Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

por Ong, Jia-Juen, Tran, Dinh-Phuc, Lan, Man-Chi, Shie, Kai-Cheng, Hsu, Po-Ning, Tsou, Nien‑Ti, Chen, Chih
Publicado 2022