Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

por Lee Sanchez, William Anderson, Li, Jia-Wun, Chiu, Hsien-Tang, Cheng, Chih-Chia, Chiou, Kuo-Chan, Lee, Tzong-Ming, Chiu, Chih-Wei
Publicado 2022

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al(2)O(3)/Boron Nitride Hybrids for Underfill Encapsulation Materials

por Lee Sanchez, William Anderson, Huang, Chen-Yang, Chen, Jian-Xun, Soong, Yu-Chian, Chan, Ying-Nan, Chiou, Kuo-Chan, Lee, Tzong-Ming, Cheng, Chih-Chia, Chiu, Chih-Wei
Publicado 2021