Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

por Bleiker, Simon J., Visser Taklo, Maaike M., Lietaer, Nicolas, Vogl, Andreas, Bakke, Thor, Niklaus, Frank
Publicado 2016

First fabrication of full 3D-detectors at SINTEF

por Hansen, Thor-Erik, Kok, Angela, Hansen, Trond A, Lietaer, Nicolas, Mielnik, Michal, Storas, Preben, Da' Via, Cinzia, Hasi, Jasmine, Kenney, Chris, Parker, Sherwood
Publicado 2009