Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

por Lim, Sung Kyu
Publicado 2013

Sidewall Slope Control of InP Via Holes for 3D Integration

por Lee, Jongwon, Roh, Kilsun, Lim, Sung-Kyu, Kim, Youngsu
Publicado 2021

Electrical Coupling and Simulation of Monolithic 3D Logic Circuits and Static Random Access Memory

por Ahn, Tae Jun, Choi, Bum Ho, Lim, Sung Kyu, Yu, Yun Seop
Publicado 2019

The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors

por Ok, Seung-Ho, Lee, Yong-Hwan, Shim, Jae Hoon, Lim, Sung Kyu, Moon, Byungin
Publicado 2017

Low-temperature growth of layered molybdenum disulphide with controlled clusters

por Mun, Jihun, Kim, Yeongseok, Kang, Il-Suk, Lim, Sung Kyu, Lee, Sang Jun, Kim, Jeong Won, Park, Hyun Min, Kim, Taesung, Kang, Sang-Woo
Publicado 2016

Antiferroelectric negative capacitance from a structural phase transition in zirconia

por Hoffmann, Michael, Wang, Zheng, Tasneem, Nujhat, Zubair, Ahmad, Ravindran, Prasanna Venkatesan, Tian, Mengkun, Gaskell, Anthony Arthur, Triyoso, Dina, Consiglio, Steven, Tapily, Kandabara, Clark, Robert, Hur, Jae, Pentapati, Sai Surya Kiran, Lim, Sung Kyu, Dopita, Milan, Yu, Shimeng, Chern, Winston, Kacher, Josh, Reyes-Lillo, Sebastian E., Antoniadis, Dimitri, Ravichandran, Jayakanth, Slesazeck, Stefan, Mikolajick, Thomas, Khan, Asif Islam
Publicado 2022