Use of electrodeposition for sample preparation and rejection rate prediction for assay of electroformed ultra high purity copper for $^{232}$Th and $^{238}$U prior to inductively...

por Hoppe, E W, Aalseth, C E, Brodzinski, R, Day, A R, Farmer, O T, Hossbach, T W, McIntyre, J I, Miley, H S, Mintzer, E E, Seifert, A, Smart, J E, Warren, G A
Publicado 2008