A rapid and cost-effective metallization technique for 3C–SiC MEMS using direct wire bonding

por Md Foisal, Abu Riduan, Phan, Hoang-Phuong, Dinh, Toan, Nguyen, Tuan-Khoa, Nguyen, Nam-Trung, Dao, Dzung Viet
Publicado 2018

Highly sensitive p-type 4H-SiC van der Pauw sensor

por Nguyen, Tuan-Khoa, Phan, Hoang-Phuong, Han, Jisheng, Dinh, Toan, Md Foisal, Abu Riduan, Dimitrijev, Sima, Zhu, Yong, Nguyen, Nam-Trung, Dao, Dzung Viet
Publicado 2018