Material design of plasma-enhanced chemical vapour deposition SiCH films for low-k cap layers in the further scaling of ultra-large-scale integrated devices-Cu interconnects

por Shimizu, Hideharu, Nagano, Shuji, Uedono, Akira, Tajima, Nobuo, Momose, Takeshi, Shimogaki, Yukihiro
Publicado 2013