Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities

por Wang, Fuliang, Zhao, Zhipeng, Nie, Nantian, Wang, Feng, Zhu, Wenhui
Publicado 2017

Graphene/Glycerin Solution-Based Multifunctional Stretchable Strain Sensor with Ultra-High Stretchability, Stability, and Sensitivity

por Qi, Zhenkun, Bian, Hailiang, Yang, Yi, Nie, Nantian, Wang, Fuliang
Publicado 2019