Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices

por Bargiel, Sylwester, Cogan, Julien, Queste, Samuel, Oliveri, Stefania, Gauthier-Manuel, Ludovic, Raschetti, Marina, Leroy, Olivier, Beurthey, Stéphan, Perrin-Terrin, Mathieu
Publicado 2023