Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

por Ong, Jia-Juen, Tran, Dinh-Phuc, Lan, Man-Chi, Shie, Kai-Cheng, Hsu, Po-Ning, Tsou, Nien‑Ti, Chen, Chih
Publicado 2022

Low-Temperature Cu/SiO(2) Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

por Ong, Jia-Juen, Chiu, Wei-Lan, Lee, Ou-Hsiang, Chiang, Chia-Wen, Chang, Hsiang-Hung, Wang, Chin-Hung, Shie, Kai-Cheng, Yang, Shih-Chi, Tran, Dinh-Phuc, Tu, King-Ning, Chen, Chih
Publicado 2022