Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices

por Bargiel, Sylwester, Cogan, Julien, Queste, Samuel, Oliveri, Stefania, Gauthier-Manuel, Ludovic, Raschetti, Marina, Leroy, Olivier, Beurthey, Stéphan, Perrin-Terrin, Mathieu
Publicado 2023

Wafer-level vapor cells filled with laser-actuated hermetic seals for integrated atomic devices

por Maurice, Vincent, Carlé, Clément, Keshavarzi, Shervin, Chutani, Ravinder, Queste, Samuel, Gauthier-Manuel, Ludovic, Cote, Jean-Marc, Vicarini, Rémy, Abdel Hafiz, Moustafa, Boudot, Rodolphe, Passilly, Nicolas
Publicado 2022