Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

por Hlina, Jiri, Reboun, Jan, Hamacek, Ales
Publicado 2021

Study of Internal Stress in Conductive and Dielectric Thick Films

por Hlina, Jiri, Reboun, Jan, Janda, Martin, Hamacek, Ales
Publicado 2022

Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

por Kalaš, David, Soukup, Radek, Řeboun, Jan, Radouchová, Michaela, Rous, Pavel, Hamáček, Aleš
Publicado 2023

Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper

por Hlina, Jiri, Reboun, Jan, Simonovsky, Marek, Syrovy, Tomas, Janda, Martin, Hamacek, Ales
Publicado 2022

FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers

por Kalaš, David, Šíma, Karel, Kadlec, Petr, Polanský, Radek, Soukup, Radek, Řeboun, Jan, Hamáček, Aleš
Publicado 2021