Efficient strain modulation of 2D materials via polymer encapsulation

por Li, Zhiwei, Lv, Yawei, Ren, Liwang, Li, Jia, Kong, Lingan, Zeng, Yujia, Tao, Quanyang, Wu, Ruixia, Ma, Huifang, Zhao, Bei, Wang, Di, Dang, Weiqi, Chen, Keqiu, Liao, Lei, Duan, Xidong, Duan, Xiangfeng, Liu, Yuan
Publicado 2020

Wafer-scale and universal van der Waals metal semiconductor contact

por Kong, Lingan, Wu, Ruixia, Chen, Yang, Huangfu, Ying, Liu, Liting, Li, Wei, Lu, Donglin, Tao, Quanyang, Song, Wenjing, Li, Wanying, Lu, Zheyi, Liu, Xiao, Li, Yunxin, Li, Zhiwei, Tong, Wei, Ding, Shuimei, Liu, Songlong, Ma, Likuan, Ren, Liwang, Wang, Yiliu, Liao, Lei, Duan, Xidong, Liu, Yuan
Publicado 2023