Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

por Roduan, Siti Faqihah, Wahab, Juyana A., Salleh, Mohd Arif Anuar Mohd, Mahayuddin, Nurul Aida Husna Mohd, Abdullah, Mohd Mustafa Al Bakri, Halil, Aiman Bin Mohd, Zaifuddin, Amira Qistina Syamimi, Muhammad, Mahadzir Ishak, Sandu, Andrei Victor, Baltatu, Mădălina Simona, Vizureanu, Petrica
Publicado 2022