Skin-Inspired Pressure Sensor with MXene/P(VDF-TrFE-CFE) as Active Layer for Wearable Electronics

por Shen, Xiao-Quan, Li, Ming-Ding, Ma, Jun-Peng, Shen, Qun-Dong
Publicado 2021

Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

por Li, Ming-Ding, Shen, Xiao-Quan, Chen, Xin, Gan, Jia-Ming, Wang, Fang, Li, Jian, Wang, Xiao-Liang, Shen, Qun-Dong
Publicado 2022