Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials

por Song, Honglie, Luo, Guoquan, Ji, Ziyao, Bo, Renheng, Xue, Zhaoguo, Yan, Dongjia, Zhang, Fan, Bai, Ke, Liu, Jianxing, Cheng, Xu, Pang, Wenbo, Shen, Zhangming, Zhang, Yihui
Publicado 2022

Assembly of complex 3D structures and electronics on curved surfaces

por Xue, Zhaoguo, Jin, Tianqi, Xu, Shiwei, Bai, Ke, He, Qi, Zhang, Fan, Cheng, Xu, Ji, Ziyao, Pang, Wenbo, Shen, Zhangming, Song, Honglie, Shuai, Yumeng, Zhang, Yihui
Publicado 2022