Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling

por Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tran, Dinh-Phuc, Chen, Chih
Publicado 2021

Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

por Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tu, K. N., Chen, Chih
Publicado 2021

Failures of Cu-Cu Joints under Temperature Cycling Tests

por Hsu, Po-Ning, Shie, Kai-Cheng, Tran, Dinh-Phuc, Tsou, Nien-Ti, Chen, Chih
Publicado 2022

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

por Hsu, Po-Ning, Lee, Dai-Lung, Tran, Dinh-Phuc, Shie, Kai-Cheng, Tsou, Nien-Ti, Chen, Chih
Publicado 2022

Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing

por Lai, Jyun-Yu, Tran, Dinh-Phuc, Yang, Shih-Chi, Tseng, I-Hsin, Shie, Kai-Cheng, Leu, Jihperng, Chen, Chih
Publicado 2023

High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation

por He, Pin-Syuan, Tran, Dinh-Phuc, Kuo, Ting-Yu, Hsu, Wei-You, Lin, Huai-En, Shie, Kai-Cheng, Chen, Chih
Publicado 2023

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

por Ong, Jia-Juen, Tran, Dinh-Phuc, Lan, Man-Chi, Shie, Kai-Cheng, Hsu, Po-Ning, Tsou, Nien‑Ti, Chen, Chih
Publicado 2022

Low-Temperature Cu/SiO(2) Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

por Ong, Jia-Juen, Chiu, Wei-Lan, Lee, Ou-Hsiang, Chiang, Chia-Wen, Chang, Hsiang-Hung, Wang, Chin-Hung, Shie, Kai-Cheng, Yang, Shih-Chi, Tran, Dinh-Phuc, Tu, King-Ning, Chen, Chih
Publicado 2022

Artificial intelligence deep learning for 3D IC reliability prediction

por Hsu, Po-Ning, Shie, Kai-Cheng, Chen, Kuan-Peng, Tu, Jing-Chen, Wu, Cheng-Che, Tsou, Nien-Ti, Lo, Yu-Chieh, Chen, Nan-Yow, Hsieh, Yong-Fen, Wu, Mia, Chen, Chih, Tu, King-Ning
Publicado 2022