Effect of Copper Sulfate and Sulfuric Acid on Blind Hole Filling of HDI Circuit Boards by Electroplating

por Tao, Pingjun, Chen, Yugan, Cai, Weitong, Meng, Zhaoguang
Publicado 2020

Study on isothermal crystallization kinetics of Zr(55.7)Cu(22.4)Ni(7.2)Al(14.7) bulk amorphous alloy

por Zhang, Weijian, Tao, Pingjun, Chen, Yugan, Si, Junfeng, Huang, Zhenghua, Zhu, Kunsen, Yang, Yuanzheng
Publicado 2022