Analytical techniques for thin films: treatise on materials science and technology

por Tu, K N, Rosenberg, R
Publicado 1988

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

por Tseng, Chih-Han, Tu, K. N., Chen, Chih
Publicado 2018

Modeling of abnormal grain growth in (111) oriented and nanotwinned copper

por Gusak, A. M., Chen, Kuan-Ju, Tu, K. N., Chen, Chih
Publicado 2021

Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface

por Huang, Chun-Lung, Weng, Wei-Lun, Liao, Chien-Neng, Tu, K. N.
Publicado 2018

Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu

por Juang, Jing-Ye, Lu, Chia-Ling, Li, Yu-Jin, Tu, K. N., Chen, Chih
Publicado 2018

Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

por Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tu, K. N., Chen, Chih
Publicado 2021

Fabrication and characteristics of highly [Formula: see text] -oriented nanotwinned Au films

por Chiu, Wei-Lan, Liu, Chien-Min, Lin, Han-wen, Wu, John A., Chou, Y.-C., Tu, K. N., Chen, Chih
Publicado 2020

Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

por Juang, Jing-Ye, Lu, Chia-Ling, Chen, Kuan-Ju, Chen, Chao-Chang A., Hsu, Po-Ning, Chen, Chih, Tu, K. N.
Publicado 2018

Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating

por Huang, E-Wen, Chou, Hung-Sheng, Tu, K. N., Hung, Wei-Song, Lam, Tu-Ngoc, Tsai, Che-Wei, Chiang, Ching-Yu, Lin, Bi-Hsuan, Yeh, An-Chou, Chang, Shan-Hsiu, Chang, Yao-Jen, Yang, Jun-Jie, Li, Xiao-Yun, Ku, Ching-Shun, An, Ke, Chang, Yuan-Wei, Jao, Yu-Lun
Publicado 2019