Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography

por Ni, Shu, Berenschot, Erwin J. W., Westerik, Pieter J., de Boer, Meint J., Wolf, René, Le-The, Hai, Gardeniers, Han J. G. E., Tas, Niels R.
Publicado 2020