Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks

por Kim, Jeongah, Kim, Bo-Young, Park, Seong Dae, Seo, Ji-Hun, Lee, Chan-Jae, Yoo, Myong Jae, Kim, Youngmin
Publicado 2021