A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps

por Chang, Yuan-Wei, Hu, Chia-chia, Peng, Hsin-Ying, Liang, Yu-Chun, Chen, Chih, Chang, Tao-chih, Zhan, Chau-Jie, Juang, Jing-Ye
Publicado 2018